Research Associate

Gaowei Xu

Title: Professor Associate
Subject: Microelectronics and advanced Packages
Phone: +86-021-62511070
Fax: +86-021-62131744
Email: xugw@mail.sim.ac.cn
Address: 865 Changning Road, Shanghai,China, 200050

RESUME

Xu Gaowei received the B.S. and M.S. degrees in electronics materials and components from Xidian University, Xi’an, China, in 1990 and 1993 respectively and received his Ph. D. degree in microelectronics and solid-state electronics from Shanghai Institute of Microsystems and Information Technology (SIMIT), Chinese Academy of Sciences (CAS), Shanghai, in 2007.

He is currently Research Associate, master advisor in SIMIT, CAS. He engaged in the field of advanced electronic packaging in 1990. Now, he is working in the National Key Lab of Microsysytem Technology in SIMIT.

He has published more than 60 papers and applied more than 60 patents. His current research interest involves advanced packaging including 3D-MCM, 3D-SiP (System in package), WLP (wafer-level package), IPD (integrated passive device) for RF module, reliability of packages as well as wearable system integration, etc.

 Major projects

National 973 Program: Development of SiP technology for new imaging sensor (2011-2015).

National Science and Technology Major Projects: Wafer level packaging technology based on RDL and high density bump technology and their industrialization (2011-2013).

Natural Science Foundation of Shanghai: Relationship between copper plastic strain and microstructure of IC wiring (2013-2016).

National project: 3D-MCM and 3D-SiP integration of node of wireless sensor network (WSN).

MAJOR HONORS

2015 The Second-class Technological Invention Awards Prize on “High sensitivity photoelectric sensor chip and a portable embedded spectrometer” by Science and technology commission of Shanghai.

2014 Outstanding Paper Award on “Low cost fabrication of TSV-based silicon interposer using wet chemical etching” by 8th International Conference on Electronics Packaging Technology (IEEE-ICEPT).

2007 Best Paper Award on “Warpage and Reliability of Three-dimensional Multi-chip Module with High Density Embedded Substrate” by 15th International Conference on Electronics Packaging Technology (IEEE-ICEPT).

1992 The 3rd-class Science and Technology Progress Award on “Failure Mechanism of Thick-film Hybrid IC” by Shaanxi Education Committee.

RESEARCH EXPERIENCE

2004 – Present, Research Associate, State Key Lab. of Transducer Technology, Shanghai Institute of Microsystems & Information Technology in Chinese Academic of Sciences, Shanghai, China. Advanced packaging including 3D-MCM, 3D-SiP, WLP, IPD for RF module, reliability of packages.

2015-2015, Visiting scholar, University of Freiburg, Freiburg, Germany

1999-2004,   Senior Engineer, Shaanxi Hitech electronic Co. Ltd, Xi’an, China. Director of project department, System integration of measurement and control.

1994- 1999,  Engineer, China National Electronics Imp. & Exp. Shaanxi Company, Xi’an, China. Electronic assembly of ammeter.

1990-1993,   Assistant Professor, Department of technology and physics science, Xidian University, Xi’an, China. Electronic materials and components including double-layer electrolytic capacitor, thin-film hybrid IC, thermal reliability of hybrid IC using FEM.

EDUCATION

2004―2007   Ph.D, Shanghai Institute of Microsystems & Information Technology in Chinese Academic of Sciences, Shanghai, China

1990―1993   Master, Xi’an University of Electronic Science and Technology (Xidian University), Xi’an, China

1986―1990   Bachelor from Xi’an University of Electronic Science and Technology (Xidian University), Xi’an, China      

SELECTED PUBLICATIONS

1)Gaowei Xu, Fei Geng, Qiuping Huang, Le Luo, Jian Zhou, Warpage Study of a 3D-MCM on an Embedded Substrate with Multiple Interconnection Method, IEEE Transactions on Components and Packaging Technologies, Vol.33, No.3, pp.571-581, 2010.

2)Gaowei Xu, Yingjun Cheng and Le Luo, Heat Transfer Characteristics and Design Optimization for a Small-sized Plate-fin Heat Sink Array, ASME Journal of Electronics Packaging, Vol.129, No.4, pp.518-521, 2007.

3)Zheng, Tao; Xu, Gaowei; Luo, Le. A novel wafer level high Q planar inductor using Ni-Zn ferrite/BCB composite thick film. ce: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p 870-874.

4)Cheng, Gong; Li, Heng; Zhang, Weibo; Xu, Gaowei; Luo, Le, Controllable large scaled nanotwin formation in Cu film at lower temperatures. Journal of Physics D: Applied Physics, v 49, n 40, September 9, 2016

5)Ye, Jiaotuo; Wang, Shuangfu; Zhu, Chunsheng; Xu, Gaowei; Luo, Le, Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of GaAs CCD. Microsystem Technologies, v 22, n 8, p 1983-1989, August 1, 2016

6)Li, Heng; Cheng, Gong; Xu, Gaowei; Luo, Le. Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite. Journal of Materials Science: Materials in Electronics, v 27, n 8, p 8325-8331, August 1, 2016

7) Zheng, Tao; Xu, Gaowei; Luo, Le. High performance suspended spiral inductor and band-pass filter by wafer level packaging technology. Microsystem Technologies, p 1-5, May 12, 2016

8)Xu, Gaowei; Gai, Wei; Zheng, Tao; Liang, Defeng; Luo, Le; Chen, Juying. Integrated manufacturing of microphone-Array node for wireless sensor network (WSN). 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p 919-922, October 4, 2016

9)Li, Heng; Cheng, Gong; Xu, Gaowei; Luo, Le. Explore of warpage origination in WLP and processing influence factors by experiment and theoretical modeling. Journal of Materials Science: Materials in Electronics, v 27, n 11, p 11548-11555, November 1, 2016

10) Li, Heng; Cheng, Gong; Xu, Gaowei; Luo, Le. The Nonlinearity of Stress Evolution in Polymer-Metal Composite Thin Films during Thermal Treatment. Proceedings - Electronic Components and Technology Conference, v 2016-August, p 510-515, August 16, 2016.

11)Li, Heng; Zhu, Chunsheng; Xu, Gaowei; Luo, Le. Experimental identification of thermal induced warpage in polymer-metal composite films. Microelectronics Reliability, v 62, p 141-147, July 1, 2016.

12)Gaowei Xu, Peili Yan, Xiao Chen, Wenguo Ning, Le Luo, Jiwei Jiao, Wafer- level Chip-to-Wafer (C2W) Integration of High-Sensitivity MEMS and ICs, International Conference on Electronic Packaging Technology & High Density Packaging, August 8-11, 2011, pp.125-129, Shanghai, China, 2011.

13)Gaowei Xu, Enliang Song, Xiao Chen, Shuangfu Wang, Chunsheng Zhu, Jiaotuo Ye and Le Luo, System Integration for Miniature Node of Wireless Sensor Network (WSN), International Conference on Electronic Packaging Technology & High Density Packaging, August 13-16, 2012, pp. 94-96, Guilin, China,  2012. 

14) Chunsheng Zhu, Wenguo Ning, Jiaotuo Ye, Gaowei Xu, Le Luo, FEA Study of the Evolution of Wafer Warpage During Reflow Process in WLP, International Conference on Electronic Packaging Technology & High Density Packaging, August 13-16, 2012, pp. 661-665, Guilin, China, 2012.

15)Gaowei Xu, Qiuping Huang, Yuan Yuan, Xiao Chen and Le Luo, Development of Flip-Chip Interconnections of Photodetector Readout Circuit (ROIC), 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)August 16-19, 2010, pp.31-33, Xi’an, China, 2010.

16)Gaowei Xu, Qiuping Huang, Wenguo Ning, Zugang Ruan, Le Luo, A Novel MEMS Package with Three-Dimensional Stacked Modules, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) , August 10-13, 2009, pp.77-80, Beijing, China, 2009.

17) Gaowei Xu, Yanhong Wu, Fei Geng, Qiuping Huang, Jian Zhou, Le LuoDevelopment of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections, 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), 2008, pp.1-7.

18)Gaowei Xu, Jian Zhou, and Le Luo, "Warpage and Reliability of Three-dimensional Multi-chip Module with High Density Embedded Substrate ", ICEPT2007 Proceedings of 8th International Conference on Electronics Packaging TechnologyShanghai, China, 2007, pp: 701-707.

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