Research Associate

Jiatao Wang

Title: Professor Associate
Subject: Particle Micro-electromechanical Systems 
Phone: +86-021-62511070
Fax: +86-021-62131744
Address: 865 Changning Road, Shanghai,China, 200050


Jiachou Wang received his B.S. and M.S. degrees in Mechanical engineering from Harbin University of Science and Technology in 2002 and 2005, respectively, and his Ph.D. degree in Mechatronics engineering from Harbin Institute of Technology in 2008. Since 2011, he has been an Associate Professor of威尼斯9778官方网站, Chinese Academy of Sciences. His research focuses mainly on the MEMS-sensor design and fabrication process, and micro-/nano-positioning and manipulation. He has published more than 20 papers in refereed journals and conference proceedings and invented more than 15 patents


The Project of Shanghai Science and Technology Commission (No.11511500800). FY2011-2013

National Natural Science Foundation of China (No.51205388). FY2013-2015

National High Technology Research and Development Program of China (863 Program) (No.SQ2015AA0401953). FY2015-2018

National Natural Science Foundation of China (No.61674160). FY2017-2020


Assistant Professor,威尼斯9778官方网站, Chinese Academy of Sciences, 2008-2010

Associate Professor,威尼斯9778官方网站, Chinese Academy of Sciences, 2011-present..


B.S., 2002, Mechanical Design and Manufacturing, Harbin University of Science and Technology

M.S., 2005, Mechanical Design and theory, Harbin University of Science and Technology

Ph.D., 2008, Mechanical Electronic Engineering, Harbin Institute of Technology


1)Jiachou Wang and Xinxin Li, “Single-side Fabrication of Multi-Level 3D Micro Structures for Monolithic Dual-Sensors,” IEEE Journal of Microelectromechanical Systems, vol. 24, no. 3, pp. 531-533, 2015.

2)Jiachou Wang and Xinxin Li, “A dual-unit pressure sensor for on-chip self-compensation of zero-point temperature drift,” J. Micromech. Microeng., vol.24, no.8, pp. 1-10, 2014.

3)Jiachou Wang and Xinxin Li, “Package-friendly piezoresistive pressure with on-chip integrated packaging-stress-suppressed suspension (PS3) technology,” J. Micromech. Microeng., vol.23, no.4, pp. 1-6, 2013.

4)Jiachou Wang, Xiaoyuan Xia and Xinxin Li, “Monolithic Integration of Pressure plus Acceleration Composite TPMS Sensors with a Single-sided Micromachining Technology,” IEEE Journal of Microelectromechanical Systems, vol. 21, no. 2, pp. 284-293, 2012.

5)Jiachou Wang and Xinxin Li, “Single-Side Fabricated Pressure Sensors for IC-Foundry Compatible, High-Yield, and Low-Cost Volume Production,” IEEE Electron Device Letters, vol. 32, no. 7, pp. 979-981, July. 2011.

6)Jiachou Wang and Xinxin Li, “A high-Performance Dual-Cantilever High-Shock Accelerometer Single-Sided Micromachinined in (111) Silicon Wafers,” IEEE Journal of Microelectromechanical Systems, vol. 19, no.6, pp. 1515-1520, Dec. 2010.

7)Fang Song and Jiachou Wang*, “A single-side microcavity-diaphragm-channel one-step formation method for low-cost and high-yield volume production of micro flow sensors,” Microelectronic Engineering, vol. 139, no.18, pp. 1-6, 2015.

8)Jiedan Liu, Jiachou Wang and Xinxin Li, “Fully Front-side Bulk-micromachined Single-chip Micro Flow-sensors for Bare-chip SMT (Surface Mounting Technology) Packaging,” J. Micromech. Microeng., vol.22, no.3, pp. 1-9, 2012.

9)Lining Sun, Jiachou Wang*, Weibin Rong, et al, “A Silicon Integrated Micro Nano-Positioning XY-stage for Nano-manipulation,” J. Micromech. Microeng., vol.18, no.12, pp. 1-9, 2008

10)Feng Yu, Jiachou Wang, Pengcheng Xu, and Xinxin Li, “A tri-beam dog-bone resonant sensor with high-Q in liquid for disposable test-strip detection of analyte droplet,” IEEE Journal of Microelectromechanical Systems, vol. 25, no.2, pp. 244-251, 2016.

11)Feng Yu, Pengcheng Xu, Jiachou Wang, Xinxin Li, “Length-extensional resonating gas sensors with IC-foundry compatible low-cost fabrication in non-SOI single-wafer,”

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